SiliconOne Mechanical Packaging Engineer

The application window is expected to close on: 03/09/2025

Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received.

Meet the Team

Cisco Silicon One is a business organization building and selling ASICs inside and outside of Cisco. We have a long track record of building large, high-performance Silicon ASICs for Cisco's internal platforms and external customers. We are a specialized ASIC team with experts in all aspects of Silicon Design and system integration. Our substrates are using the latest fanout technologies for large scale integration. We are focused on all the latest technologies including optical and advanced packaging.

Your Impact

Cisco SiliconOne ASIC team is looking for an expert in advanced silicon substrate mechanical analysis to help us develop our next generation silicon and platforms. You will have advanced experience with co-simulation of silicon ASIC, interposer technologies, package substrate and PCB. You will be involved in substrate material development and SMT attach strategies and involved in multiple aspects of substrate planning and layout to make new silicon products successful. You will develop advanced packages utilizing new fanout technologies using new materials. You will lead thermal-mechanical analysis for preferred package and board attach and explore optimizations. You will extend a track record of leading similar products to first pass success by minimizing package design iterations.

You are a mechanical engineer with substrate expertise working on cutting-edge technologies and developing substrates that push the boundaries on power, integration, and fabrication/assembly technology. The scope of package development is industry leading. You will be working on and driving the design of the world's most complex networks powered by silicon that carries over 90% of IP traffic. You will be an avid learner, eager to learn and process new technologies and rules, and excel in documenting and communicating critical information to the team.

Responsibilities:

* Setup models, integrating materials from PCB, BGA, substrate, bump, interposer, ASIC and all thermal attach solutions for large pin count devices
* Firm grasp of material science and the impact on substrate and final assembly.
* Work with complex assemblies with HBM and chiplets
* Understand and simulate the impact at different temperatures, especially SMT attach.
* Work with thermal modeling team to review models and simulations and impact on mechanical behavior
* Understand the complexities of qualification and challenges of bump and BGA placement
* Collaborate with package, system, and product operations teams to build a product
* Focus will be primarily on flip chip packages and heterogeneous integration of chip package design
* Understand and drive towards milestones to make development successful
* Contribute to team design reviews with actionable feedback to improve quality, capability, and experience of teammates

Minimum Qualifications:

* Bachelor's in Mechanical Engineering or related field, or equivalent experience
* 12 or more years of experience in the industry with IC Package or PCB development
* Experience with several high pin count, high-power and high-speed packages or equivalent PCBs and leading them to production
* Experience with fabrication and assembly design rules both for package as well as board
* Experience with assembly and package layout standards
* Experience in designing fully integrated mechanical solutions
* Knowledge of packaging materials and material properties
* May have direct reports in the Asia Pacific time zone * Must be able to travel to Asia twice a year

Preferred Qualifications:

* Master's degree in Mechanical Engineering
* Knowledge of Icepak and Flotherm
* Knowledge of mechanical simulation tools, Ansys Mechanical
* Experience with mechanical and thermal analysis and familiarity with lab equipment used for material characterization and failure analysis
* Familiarity and Interest in Advanced package layout with multiple die and non-symmetric layout
* Experience with Thermal modeling and simulation a plus

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