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Failure Analysis Engineer

Tower Semiconductor
United States, Texas, San Antonio
Aug 20, 2026
About Tower Semiconductor

Looking for a career path in the high-tech industry? Become part of a team focused on delivering the most exciting semiconductor technology in the world! If you enjoy working with others in a dynamic, fast-paced environment and are looking for an opportunity to grow your career in this exciting industry, then Tower Semiconductor is the place to be!

Tower Semiconductor, the leading foundry of high-value analog semiconductor solutions, provides technology, development, and process platforms for analog integrated circuits to more than 300 customers worldwide across growing markets such as communications, mobile, infrastructure, consumer, industrial, automotive, medical, and aerospace and defense, among others.

Join Tower and become part of a dynamic organization with exceptionally talented and dedicated team members who work collaboratively to provide best-in-class technological solutions to our clients.

Job Description

Tower Semiconductor is seeking a Failure Analysis Engineer to join our growing manufacturing site in San Antonio. This is a permanent, externally posted position.

In this role, you will perform wafer- and die-level physical failure analysis across multiple semiconductor technologies, applying advanced analytical techniques to isolate failures, characterize defects, and determine root causes. Our San Antonio fab delivers specialty electronic and photonics devices for a wide range of applications, with a strong commitment to high quality, low cost, and efficient cycle times.

The ideal candidate will bring excellent analytical and communication skills, along with hands-on training and experience in electron microscopy techniques such as TEM, SEM, and FIB. Prior experience in semiconductor failure analysis is a plus.

This Job Is For You If
  • Perform wafer and die level physical failure analysis across multiple semiconductor technologies, utilizing advanced analytical techniques to isolate failures, characterize defects, and determine root-causes.
  • Perform sample preparation methodologies, including wafer cleaving, cross-sectioning, mechanical polishing, wet chemical etching, and optical microscopy inspection.
  • Conduct structural, material, and defect characterization using SEM, FIB, TEM/STEM, and EDX.
  • Analyze experimental data, document findings, and prepare comprehensive technical reports that clearly communicate experimental procedures and failure mechanisms.
  • Collaborate with process, yield, integration, and equipment engineering teams to resolve device and process-related issues and improve product quality.
  • Maintain compliance with safety procedures and laboratory practices, ensure proper equipment handling, and contribute to continuous improvement of lab workflows, documentation, and overall efficiency.
Job Requirements

Must Have:

  • B.S. degree or M.S degree
  • Minimum of 3 years of relevant experience in an engineering or scientific discipline.
  • Strong written and verbal communication skills.
  • Demonstrated strong analytical and problem-solving abilities.

Nice to Have:

  • Familiarity with semiconductor device physics and device architecture is a plus.
  • Highly disciplined and organized, with strong multitasking abilities and the capacity to effectively manage multiple activities simultaneously.
  • Strong understanding of electron microscopy principles, analytical techniques, and related equipment.
  • Hands-on training and experience in optical & electron-microscopy techniques.

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