Solderer (BGA Repair Operator)

At SCI Technology, a Sanmina Company, we serve those who serve by delivering innovative, trusted and comprehensive products and services that meet and exceed the unique needs of the Defense and Aerospace sector. From avionics to tactical and airborne communications, counter-UAS, integrated manufacturing and cradle-to-grave product life cycle support, we deliver high-reliability solutions that keep service members connected and protected in the field.

Our heritage dates to 1961, as an early supplier to the space program in Huntsville, Alabama. Today, SCI offers a complete range of Defense & Aerospace solutions through our three business segments - Products, Systems Build, and Life Cycle Services. It's SCI summed up - ALL WE DO to serve those who serve.

At this time, SCI is recruiting highly qualified candidates whose background and career goals meet our needs for the following position in Huntsville, AL. Please note that due to Department of Defense contract requirements, U.S. CITIZENSHIP IS REQUIRED

Solderer (BGA Repair Operator)

The BGA (Level IV) Repair Operator is responsible for performing highly skilled board-level repair tasks, specifically focusing on the removal and replacement of Ball Grid Array (BGA) components. The role ensures that all repairs are performed consistently and accurately to meet IPC Class II and Class III standards without damaging the printed circuit board (PCB) or surrounding components.

• BGA Removal & Replacement: Demonstrate the ability to remove BGAs from the PCB without causing damage to the board substrate.
• Component Identification: Correctly identify specific BGAs designated for removal and replacement.
• Precision Repair: Perform repairs on boards with heavy ground planes or other complex characteristics while preventing defects such as debris, solder balls, or thermal damage.
• Material Traceability: Identify and obtain correct replacement parts through approved channels, ensuring that traceability is maintained and no "stashes" of parts are kept.
• X-Ray Inspection: Utilize X-ray equipment to inspect repairs, demonstrating the ability to detect bad solder joints, identify specific defects, and locate debris.
• Scrap & Documentation: Process scrap material related to repair parts, including writing up WMRB Red Tags and delivering material to designated locations.
• Data Entry: Scan repair actions to the board and move the board to the appropriate manufacturing location in the system upon completion.
• Tool Utilization: Proficiently use regular and micro soldering irons, air pencils, solder wicks, and other specialized BGA repair tools.

• Training Certification: Completion of the 72-Hour Soldering Training is required to be considered for training/certification in this role.
• Technical Knowledge:
  
  
  
  • Must understand IPC Class II and Class III types and requirements.
  • Familiarity with SMT Guidelines specifically covering repair processes.
  
  
  
  
• Citizenship: U.S. Citizenship is required.
• Soft Skills: Must have a positive attitude, be a team player, and be willing to work overtime as needed to meet production demands.

• Ability to perform fine manual dexterity tasks under a microscope for extended periods.
• Willingness to work in a manufacturing environment which may include exposure to chemicals and soldering fumes.
• Ability to work late shifts or overtime during periods of increased demand.

Education/Experience

High School Diploma or equivalent

Associate's degree in a technical field is a plus.

4-6 years of related experience

Sanmina is an Equal Opportunity Employer