Principal Packaging Engineer

Skyworks designs, develops, and packages premier semiconductor solutions for the RF and wireless markets. The company utilizes leading edge packaging technology to achieve maximum RF performance, and superior quality/reliability at a competitive cost.

Skyworks is seeking a highly experienced Principal Engineer to lead the development of advanced semiconductor packaging and assembly technologies for next-generation RF and wireless products.

This role is ideal for a recognized subject matter expert who is passionate about driving technology innovation, solving complex manufacturing challenges, and influencing the future packaging roadmap of a market-leading semiconductor company.

As a technical leader, you will work across design, manufacturing, suppliers, reliability, and customer teams to develop scalable, high-performance packaging solutions that meet aggressive cost, quality, and reliability targets.

Preferred location is Irvine, CA, although other locations may be considered for exceptional candidates.

• Lead the development, qualification, and production ramp of advanced semiconductor packaging technologies.
• Drive process innovation across MCM, chip-and-wire, flip-chip, and SiP assembly platforms.
• Define and execute DOE plans, process optimization strategies, and root-cause investigations.
• Partner with design teams, manufacturing sites, equipment suppliers, and material vendors to enable next-generation package solutions.
• Improve product performance, manufacturability, yield, reliability, and cost through process and technology development.
• Evaluate and introduce new materials, equipment, and assembly processes.
• Guide technology qualification and reliability assessment activities.
• Lead complex cross-functional projects and influence strategic packaging decisions across the organization.
• Mentor engineers and contribute to Skyworks' long-term packaging technology roadmap.

Please note that the responsibilities listed above are intended to describe the general nature and level of work performed in this role and are not intended to be an exhaustive list of all duties, responsibilities, or qualifications. Additional duties and responsibilities may be assigned as business needs evolve

• BS degree in Mechanical Engineering, Materials Science, Process Engineering, Electrical Engineering, or a related discipline.
• 12+ years of experience in semiconductor packaging, assembly process development, or advanced manufacturing (8+ years with an MS degree).
• Proven success developing and transferring packaging technologies into high-volume production.

Deep expertise in one or more of the following areas:

• SMT (Surface Mount Technology)
• Wire Bond
• Molding
• Singulation
• EMI Sputter Shielding
• ENIG Plating
• Wafer DPS
• Flip-Chip Assembly
• Materials Development
• Related semiconductor assembly processes

• Strong background in DOE, SPC, FMEA, and process characterization.
• Solid understanding of semiconductor reliability methodologies and qualification standards.
• Demonstrated technical leadership in cross-functional engineering environments.
• Excellent communication, project management, and problem-solving skills.
• Ability to drive results, influence stakeholders, and execute through ambiguity.
• Experience with advanced packaging technologies such as WLFO, Wafer Bumping, RDL, heterogeneous integration, or advanced SiP solutions.
• Experience supporting RF, wireless, or high-frequency semiconductor products.
• Knowledge of module-level and board-level reliability requirements.
• Experience with organic laminate substrates and package materials.
• Understanding of DFM and design rule methodologies.
• Package design experience using Cadence Allegro, APD, or SiP design tools.
• Prior experience leading technology development programs, packaging R&D initiatives, or engineering roadmaps.

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